Hamamatsu says its iPHEMOS-DDX inverted emission microscope is designed for fault analysis in chiplets, HBM and 2.5D/3D semiconductor packages. Worldwide orders begin September 29; the company plans to exhibit the system at ISTFA in October.
GLOBAL IMAGING BRIEF
Analysis: more complex stacked packages increase the value of locating faults without unnecessary disassembly. Buyers should test access to relevant package regions, tester integration, spatial resolution and analysis time on their own samples.
Full perspective
Hamamatsu describes flexible integration into existing tester-based measurement environments. That is a supplier-stated design aim, not evidence of compatibility with every tester or proof of a measured reduction in analysis time across package types.
Advanced-package evaluation should include reference defects, sample fixturing, electrical stimulus, image registration and a documented decision path to the root cause. Ask the supplier which package sizes and layouts are supported and what preparation is required. The announcement establishes availability for orders, while performance and delivery terms remain application-specific.
Original source
Original source: Hamamatsu Photonics announcement, September 29, 2026. October ISTFA display is a planned event, not a completed demonstration.