Nikon announced the DSP-110 on October 13 for advanced-package redistribution-layer patterning. It specifies 1.5 µm line-and-space resolution and 72 panels per hour on 510 × 515 mm substrates, about 40% more throughput than DSP-100 under the stated comparison. Release is scheduled for April 2027, not yet commercial shipment.
GLOBAL IMAGING BRIEF
The optical-system redesign trades a 1.5 µm standard resolution for higher throughput while retaining an optional path to 1.0 µm via optical replacement. Packaging customers should assess resolution, overlay and throughput together for their process mix.
Original source
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