The Open CPX Multi Source Agreement Group released a specification for co-packaged and near-package connector and optics modules. The framework describes 6.4T and 7.2T connectivity options, 200 Gb/s-per-lane signaling, internal or external laser choices, module management, and thermal provisions aimed at next-generation AI-cluster interconnects.
GLOBAL IMAGING BRIEF
Analysis: A common pluggable form factor could reduce dependence on proprietary CPO implementations and create clearer interfaces among optical-engine suppliers, connector makers, switch vendors, and test providers. Adoption and interoperability still need to be demonstrated in products and manufacturing volumes.
Original source
This brief is an original summary based on the cited public source.