Teradyne announced the UltraFLEXplus S series on October 12. Its first model, the 24-slot S24, targets engineering and production test in high-mix, variable-volume semiconductor manufacturing, including multimedia and edge-AI devices. The announcement describes platform capabilities, not customer deployment results.
GLOBAL IMAGING BRIEF
Imaging and vision processors increasingly sit within heterogeneous edge-AI hardware. More flexible test capacity could help chip suppliers manage changing product mixes, though throughput and cost benefits require validation in each production setting.
Original source
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